Description:

• High thermal conductivity;
• Easy machining, free of porosity;
•Already seasoned, thermal grain microstructure dispensing allows excellent polishing;
•Optimum corrosion resistance, Possibility of welding;
•Allows surface treatment;
•Freedom of design, effective cooling, productivity, quality of plastic parts;
•High mechanical resistance. Reduce production time by optimizing the use of injection molding machines.

Application:

•Casing of metal molds;
•Injection Molds.

Chemical Properties:

Material Percentage (Average)

CU 98,2 %
BE 1,8 %

Physical and mechanical properties:

•Hardness (Rockwell): 30 a 40 HRC
• Conductivity: 28 a 30 % IACS